Engineering Bookshelf

Electronic Engineering Books
Book Cover: Digital Integrated CircuitsDigital Integrated Circuits
by Jan M. Rabaey, Anantha Chandrakasan, Borivoje Nikolic

Publisher: Prentice Hall
ISBN: 0130909963


Since the publication of the first edition of this book in 1996, CMOS manufacturing technology has continued its breathtaking pace, scaling to ever-smaller dimensions. Minimum feature sizes are now reaching the 100-rim realm. Circuits are becoming more complex, challenging the productivity of the designer, while the plunge into the deep-submicron space causes devices to behave differently and brings to the forefront a number of new issues that impact the reliability, cost, performance, power dissipation, and reliability of the digital IC.

This updated text reflects the ongoing (r)evolution in the world of digital integrated circuit design, caused by this move into the deep-submicron realm.



Book Cover: Fundamentals of Power Semiconductor DevicesFundamentals of Power Semiconductor Devices
by B. Jayant Baliga

Publisher: Springer
ISBN: 0387473130


Fundamentals of Power Semiconductor Devices provides an in-depth treatment of the physics of operation of power semiconductor devices that are commonly used by the power electronics industry.

Analytical models for explaining the operation of all power semiconductor devices are developed. The treatment focuses on silicon devices but includes the unique attributes and design requirements for emerging silicon carbide devices.



Book Cover: Analysis and Design of Analog Integrated CircuitsAnalysis and Design of Analog Integrated Circuits
by Paul R. Gray, Paul J. Hurst, Stephen H. Lewis, Robert G. Meyer

Publisher: Wiley
ISBN: 0470245999


This is the only comprehensive book in the market for engineers that covers the design of CMOS and bipolar analog integrated circuits. The fifth edition retains its completeness and updates the coverage of bipolar and CMOS circuits.

A thorough analysis of a new low-voltage bipolar operational amplifier has been added to Chapters 6, 7, 9, and 11.

Chapter 12 has been updated to include a fully differential folded cascode operational amplifier example. With its streamlined and up-to-date coverage, more engineers will turn to this resource to explore key concepts in the field.



Book Cover: CMOS Digital Integrated Circuits Analysis & DesignCMOS Digital Integrated Circuits Analysis & Design
by Sung-Mo Kang, Yusuf Leblebici

Publisher: McGraw-Hill Science/Engineering/Math
ISBN: 0072460539


CMOS Digital Integrated Circuits: Analysis and Design is the most complete book on the market for CMOS circuits. Appropriate for electrical engineering and computer science.

This book starts with CMOS processing, and then covers MOS transistor models, basic CMOS gates, interconnect effects, dynamic circuits, memory circuits, BiCMOS circuits, I/O circuits, VLSI design methodologies, low-power design techniques, design for manufacturability and design for testability.



Book Cover: Digital Integrated Circuit DesignDigital Integrated Circuit Design
by Ken Martin

Publisher: Oxford University Press
ISBN: 0195125843


Working from the fundamentals of transistor-level design and building up to system-level considerations, Digital Integrated Circuit Design shows students with minimal background in electronics how to design state-of-the-art high performance digital integrated circuits. Ideal as an upper-level undergraduate text, it can also be used in first-year graduate courses and as a reference for practicing engineers.



Book Cover: Semiconductor Device FundamentalsSemiconductor Device Fundamentals
by Robert F. Pierret

Publisher: Addison Wesley
ISBN: 0201543931


From one of the principal authors of the Addison-Wesley Modular Series on Solid State Devices comes a first: an authoritative and innovative text for the undergraduate course, Semiconductor Device Fundamentals by Robert F. Pierret of Purdue University. By incorporating computer-based exercises and homework problems and providing interesting supplementary readings, the author gives students a meaningful and challenging experience in their first substantial encounter with semiconductor devices.



Book Cover: Design of Integrated Circuits for Optical CommunicationsDesign of Integrated Circuits for Optical Communications
by Behzad Razavi

Publisher: Wiley
ISBN: 1118336941


The only book on integrated circuits for optical communications that fully covers High-Speed IOs, PLLs, CDRs, and transceiver design including optical communication.

The increasing demand for high-speed transport of data has revitalized optical communications, leading to extensive work on high-speed device and circuit design. With the proliferation of the Internet and the rise in the speed of microprocessors and memories, the transport of data continues to be the bottleneck, motivating work on faster communication channels. Design of Integrated Circuits for Optical Communications, Second Edition deals with the design of high-speed integrated circuits for optical communication transceivers.



Book Cover: Device Electronics for Integrated CircuitsDevice Electronics for Integrated Circuits
by Richard S. Muller, Theodore I. Kamins, Mansun Chan

Publisher: Wiley
ISBN: 0471593982


Focusing specifically on silicon devices, the Third Edition of Device Electronics for Integrated Circuits takes students in integrated-circuits courses from fundamental physics to detailed device operation. Because the book focuses primarily on silicon devices, each topic can include more depth, and extensive worked examples and practice problems ensure that students understand the details.



Book Cover: Semiconductor Manufacturing TechnologySemiconductor Manufacturing Technology
by Michael Quirk, Julian Serda

Publisher: Prentice Hall
ISBN: 0130815209


In this book, Quirk and Serda introduce the terminology, concepts, processes, products, and equipment commonly used in the manufacture of ultra large scale integrated (ULSI) semiconductors. The book provides helpful, up-to-date technical information about semiconductor manufacturing and strikes an effective balance between the process and equipment technology found in wafer fabrications.

Topics include copper interconnect; dual damascene additive process for metallization; deep UV sub-micron photolithography (.18 micron and below); low-k dielectric processing; chemical mechanical planarization; a comprehensive model of manufacturing process; chemical-mechanical polish (CMP); and maintenance and troubleshooting. For practicing semiconductor manufacturing technicians or those interested in semiconductor manufacturing technology and processes.